Paper
1 October 1999 Dry release process of anhydrous HF gas-phase etching for the fabrication of a vibrating microgyroscope
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Proceedings Volume 3892, Device and Process Technologies for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.364477
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia
Abstract
A micro gyroscope, which vibrates in two orthogonal axes on the substrate plane, is designed and fabricated. Fabrication processes of the micro gyroscope are composed of anisotropic silicon etching by RIE, dry release by newly developed anhydrous HF gas-phase etching (GPE) of the buried sacrificial oxide layer, stress relief by multi-step annealing, metal electrode formation. The GPE process was verified as a very effective method for the release of compliant microstructures of micro gyroscope. The developed GPE system with anhydrous HF gas and CH3OH vapor was characterized and its etching properties were discussed. We successfully fabricated micro gyroscope with no virtually process-induced stiction and no residual products after GPE of TEOS, LTO, and thermal oxide on silicon substrates.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Won-Ick Jang, Chang-Auck Choi, Yoonshik Hong, Chi-Hoon Jun, Youn Tae Kim, and Jong-Hyun Lee "Dry release process of anhydrous HF gas-phase etching for the fabrication of a vibrating microgyroscope", Proc. SPIE 3892, Device and Process Technologies for MEMS and Microelectronics, (1 October 1999); https://doi.org/10.1117/12.364477
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KEYWORDS
Etching

Oxides

Gyroscopes

Silicon

HF etching

Low pressure chemical vapor deposition

Reactive ion etching

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