Vertically sensitive accelerometer and its realization by deep-UV-lithography-supported electroplating

Wenmin Qu; Christian Wenzel; Norbert Urbansky; Andreas Jahn

doi:10.1117/12.364474

29 September 1999 Vertically sensitive accelerometer and its realization by deep-UV-lithography-supported electroplating

Wenmin Qu, Christian Wenzel, Norbert Urbansky, Andreas Jahn

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Proceedings Volume 3891, Electronics and Structures for MEMS; (1999) https://doi.org/10.1117/12.364474
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

A vertically sensitive acceleration sensor has been fabricated by combining the low-cost UV-LIGA process with a sacrificial layer technique. The key structure of the sensor is an asymmetric proof-mass which is suspended over two stationary electrodes. Because of the asymmetric arrangement of the proof-mass, an acceleration in the Z-direction results in an opposite deflection of its large and small parts. Hence, the acceleration can be detected by the differential capacitor arrangement between the proof-mass and the two stationary electrodes. The fabrication of this vertically sensitive accelerometer is a planar batch procedure comprising only a few processing steps. The entire structures are first grown electrochemically within the UV- patterned thick AZ4562 photoresist on an electroplating base that composes of rigid and sacrificial layers. Moveable Ni- parts are then obtained by removing the underneath titanium sacrificial layer using wet etching. Sensor structures up to 30 nm with an aspect ratio of about 10:1 can be reliably manufactured. It is thought that this fabrication approach can be widely applied to economically realize other micromechanical components with oscillating structures. Design and realization of the vertically sensitive accelerometer is described in this paper.

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Wenmin Qu, Christian Wenzel, Norbert Urbansky, and Andreas Jahn "Vertically sensitive accelerometer and its realization by deep-UV-lithography-supported electroplating", Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); https://doi.org/10.1117/12.364474

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KEYWORDS

Sensors

Electroplating

Electrodes

Photoresist materials

Titanium

Copper

Etching

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