Flip-chip process development using recessed bonding pads for laser/MEMS integration

Michel A. Rosa; Decai Sun

doi:10.1117/12.364472

29 September 1999 Flip-chip process development using recessed bonding pads for laser/MEMS integration

Michel A. Rosa, Decai Sun

Proceedings Volume 3891, Electronics and Structures for MEMS; (1999) https://doi.org/10.1117/12.364472
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

This paper presents and discusses experimental results which successfully demonstrate using flip-chip techniques, the bonding and operation of a GaAs edge emitting laser on a silicon substrate having recessed bonding pads. The flip chip alignment and bonding technique is discussed first, focusing on experimental results for both flux and flux-less forms of solder bump processing, the developed flux-less technique is shown to provide comparable solder bump integrity and yield. Subsequent to the newly developed solder bump fabrication methodology shown, a recessed bonding pad design is introduced and demonstrated experimentally to aid in the final coarse alignment and assembly of the GaAs laser device onto a silicon substrate. Together both the flux-less solder bump and bonding pad recess design and fabrication processes provide increased reliability for integration with MEMS and MOEMS based devices and systems over traditional methods for hybrid device attachment.

Citation Download Citation

Michel A. Rosa and Decai Sun "Flip-chip process development using recessed bonding pads for laser/MEMS integration", Proc. SPIE 3891, Electronics and Structures for MEMS, (29 September 1999); https://doi.org/10.1117/12.364472

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available