Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

Sven Schmidbauer; Stefan Spinler; M. U. Lehr; J. Klotzsche; J. Hahn

doi:10.1117/12.360582

11 August 1999 Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization

Sven Schmidbauer, Stefan Spinler, M. U. Lehr, J. Klotzsche, J. Hahn

Proceedings Volume 3883, Multilevel Interconnect Technology III; (1999) https://doi.org/10.1117/12.360582
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

In many fabs for quarter micron and below technologies a stack consisting of Ti/TiN/AlCu/TiN or Ti/AlCu/TiN is being used for metallization. A new approach for metal stack deposition of 0.25 micrometers and beyond, utilizing hew design rules, has been used for DRAM processes. The novel metal deposition process uses an insitu nitrogen purge directly after deposition of bottom Ti to achieve a passivation of the Ti with a thin nitride before deposition of AlCu. This novel approach has been compared to standard metallization stacks consisting of Ti/AlCu/TiN and Ti/TiN/AlCu/TiN.

Citation Download Citation

Sven Schmidbauer, Stefan Spinler, M. U. Lehr, J. Klotzsche, and J. Hahn "Novel metallization scheme using nitrogen passivated Ti liner for AlCu-based metallization", Proc. SPIE 3883, Multilevel Interconnect Technology III, (11 August 1999); https://doi.org/10.1117/12.360582

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available