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The sub-threshold characteristics and the reliability of BJTs, using platinum contact silicide (PtSi) or titanium contact silicide (TiSi2), are compared and analyzed. During processing, it is observed that the TiSi2 process produces higher interface state density (Dit) than the PtSi process. The increase in Dit not only leads to a higher base current in the BJTs, but also leads to a lower transconductance for the MOS transistors. The data also show that the impact on NPN and nMOS is more severe than the impact of PNP and pMOS, respectively. This can be explained by the non-symmetric interface state distribution, the re- activation of boron, and/or by substrate trap centers. The amount of interface states produced depends not only on the thickness of the titanium film deposited, but also on the temperature and duration of the titanium silicide process. The electrical data indicates that after all the Back-End- Of-The-Line processing steps, which includes a forming gas anneal, Dit is still higher on wafers with the TiSi2 transistor's base current increases at different rates between the two processes, but eventually levels off to the same final value. However, the PNP transistor's base current increases at approximately the same rate, but eventually levels off at different final values. These indicate that the TiSi2 process may have modified the silicon and oxygen dangling bond structure during its high temperature process in addition to removing the hydrogen from the passivated interface states.
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