Application of CD-SEM edge-width measurement to contact-hole process monitoring and development

Jean Y. M. Yang; Ian M. Dudley

doi:10.1117/12.361297

3 September 1999 Application of CD-SEM edge-width measurement to contact-hole process monitoring and development

Jean Y. M. Yang, Ian M. Dudley

Proceedings Volume 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V; (1999) https://doi.org/10.1117/12.361297
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

In this paper, we describe the application of the edge width measurement to the monitoring of contact hole openings in an attempt to evaluate its ultimate limitations due to tool resolution, measurement algorithm, and process sensitivity. Substantial variations in the top-down SEM image and waveform translated to smaller but still detectable variations in measured edge width using a max slope/linear regression algorithm. The images and waveforms indicate the top-down SEM resolution to be sufficient to detect process variations, but the measured results suggest optimization of the algorithms for this specific purpose will be necessary.

Citation Download Citation

Jean Y. M. Yang and Ian M. Dudley "Application of CD-SEM edge-width measurement to contact-hole process monitoring and development", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); https://doi.org/10.1117/12.361297

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