Using laser surface scanning and bare wafer review to diagnose photolithography track developer process-induced defect issues

Linda M. Bond; Christine Fischer; Michael J. Satterfield; Dan Sutton; Karen L. Turnquest

doi:10.1117/12.350841

14 June 1999 Using laser surface scanning and bare wafer review to diagnose photolithography track developer process-induced defect issues

Linda M. Bond, Christine Fischer, Michael J. Satterfield, Dan Sutton, Karen L. Turnquest

Author Affiliations +

Proceedings Volume 3677, Metrology, Inspection, and Process Control for Microlithography XIII; (1999) https://doi.org/10.1117/12.350841
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

With the growing complexity of I-line and DUV photolithography processes, defect monitoring and yield improvement is becoming more critical and challenging. In addition to product wafer scans, reliable unpatterned wafer scans, with their advantage of much quicker feedback time for tool qualification and/or process monitoring must be developed and implemented. Especially with the more wide spread use of the newer chemically amplified resist, a high sensitivity, easy to review and trouble-shoot monitor is essential. A laser scanning unpatterned wafer defect detection tool was used to scan developed unpatterned photoresist coated wafers. Defect recipe creation for detecting these defects involved using the size of a calibration media was not used since it is not at all representative of the way real process defects scatter light. A novel, non-destructive media was not used since it is not at all representative of the way real process defects scatter light. A novel, nondestructive unpatterned wafer review method was used to actually review the defects using darkfield microscopy, and to determine real defects from false calls. From this work we were able to detect defect process signatures and defects that were related to the develop dispense configuration. Darkfield microscopy revealed the defects were indeed developer related since they appeared as liquid spot type defects and/or residue. Subsequent use of this method has been established as an excellent troubleshooting method to finding and fixing photo defect issues. The methods and results of this work will be discussed.

Citation Download Citation

Linda M. Bond, Christine Fischer, Michael J. Satterfield, Dan Sutton, and Karen L. Turnquest "Using laser surface scanning and bare wafer review to diagnose photolithography track developer process-induced defect issues", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350841

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available