Characterization of overlay tolerance requirements for via to metal alignment

John A. Allgair; Mike Schippers; Brad Smith; Richard C. Elliott; John D. Miller; John Charles Robinson

doi:10.1117/12.350811

14 June 1999 Characterization of overlay tolerance requirements for via to metal alignment

John A. Allgair, Mike Schippers, Brad Smith, Richard C. Elliott, John D. Miller, John Charles Robinson

Proceedings Volume 3677, Metrology, Inspection, and Process Control for Microlithography XIII; (1999) https://doi.org/10.1117/12.350811
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

Decreasing metal interconnect dimensions have led to tighter overlay tolerance requirements to ensure via to metal contact. These strict requirements often test the alignment capability of a manufacturing line; therefore, careful characterization is required to justify the overlay specification limits. A variety of technique can be combined for overlay process characterization including electrical resistance measurements, optical overlay measurements, CD SEM via misalignments and x-section yield. Available characterization techniques are then used to fully study the process window. Characterization data will be presented for a copper interconnect process.

Citation Download Citation

John A. Allgair, Mike Schippers, Brad Smith, Richard C. Elliott, John D. Miller, and John Charles Robinson "Characterization of overlay tolerance requirements for via to metal alignment", Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); https://doi.org/10.1117/12.350811

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