Packaging of lenslet array on micromirrors

Adisorn Tuantranont; Victor M. Bright; Wenge Zhang; Yung-Cheng Lee

doi:10.1117/12.348308

30 April 1999 Packaging of lenslet array on micromirrors

Adisorn Tuantranont, Victor M. Bright, Wenge Zhang, Yung-Cheng Lee

Proceedings Volume 3631, Optoelectronic Integrated Circuits and Packaging III; (1999) https://doi.org/10.1117/12.348308
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

A packaging technology has been developed to integrate a lenslet array with surface micromachined segmented deformable micromirrors. 12 X 12 electrostatic micromirror arrays were fabricated through a commercial surface micromachining process and integrated with glass microlenses positioned directly over the micromirror. Control of the spacing and the lateral alignment between the lenslet array and the micromirrors was important for effective fill factor. The spacing control was accomplished using glass spacer, and the lateral alignments were achieved by the use of an interferometric microscope. Measured results of the micromirrors' optical performance demonstrated the success of the packaging technology.

Citation Download Citation

Adisorn Tuantranont, Victor M. Bright, Wenge Zhang, and Yung-Cheng Lee "Packaging of lenslet array on micromirrors", Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); https://doi.org/10.1117/12.348308

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