Surface-mount-type LD module

Tsutomu Nakamura; Hajime Hotta; Tokihiro Terashima; Hiroshi Arimoto; Masanobu Kato

doi:10.1117/12.345425

14 April 1999 Surface-mount-type LD module

Tsutomu Nakamura, Hajime Hotta, Tokihiro Terashima, Hiroshi Arimoto, Masanobu Kato

Proceedings Volume 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV; (1999) https://doi.org/10.1117/12.345425
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

An optical module is assembled using a passive-alignment technique. A laser diode (LD), a single mode fiber with a ferrule and a monitor photo diode (PD) are mounted on a silicon (Si) substrate. The LD and the PD are adjusted in three axis direction (horizontal axis, light axis and horizontal angle axis) to be die-bonded. The fiber is laid between a V-groove on the Si substrate and a glass block. In the perpendicular axis direction, the V-groove width is set so that the LD active layer and the fiber core are at the same height. The optical devices and the fiber facet are sealed using a thermosetting resin material. The Si substrate is bonded in a nonhermetic-sealed plastic package. The coupling losses of the LDs to the butt-jointed single mode fibers are estimated to be 7.4 to 10.8 dB, to the average value of 8.6 dB. The tracing errors of the fabricated modules are less than +/- 1.5 dB at ambient temperature from -40 to +85 degrees centigrade. The coupling losses change at the damp-heat stress test (85 degrees and 85% RH) is less than +/- 0.5 dB after more than 5,000 hours.

Citation Download Citation

Tsutomu Nakamura, Hajime Hotta, Tokihiro Terashima, Hiroshi Arimoto, and Masanobu Kato "Surface-mount-type LD module", Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); https://doi.org/10.1117/12.345425

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