Paper
28 August 1998 Implementation of a standardized 0.35-μm WLR test vehicle
Ehren Achee, Greg Petter, James Reedholm
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Abstract
The first global demonstration of wafer-level reliability (WLR) test structure and methodology effectiveness is in progress. This action, initiated by an organization of fabless companies and concentrated on foundry service providers, represents a market-driven effort. WLR has been discussed, evaluated, promoted and even made a requirement in semiconductor IC procurement documents. This project utilizes a common suite of WLR structures fabricated at most commercial foundries to demonstrate the effectiveness of WLR structures for use as process monitors.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ehren Achee, Greg Petter, and James Reedholm "Implementation of a standardized 0.35-μm WLR test vehicle", Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); https://doi.org/10.1117/12.324371
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KEYWORDS
Reliability

Metals

Oxides

Transistors

Capacitors

Structural design

Antennas

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