Paper
22 May 1998 3D optoelectronic stacked processors: design and analysis
Author Affiliations +
Proceedings Volume 3490, Optics in Computing '98; (1998) https://doi.org/10.1117/12.308872
Event: Optics in Computing '98, 1998, Bruges, Belgium
Abstract
We present the design and analysis of a 3D OptoElectronic Stacked Processor System. This system is aimed at combining stacked VLSI chips with free-space optoelectronic Inputs and Outputs for optimal power*volume/throughput balance. Challenges in such systems include finding appropriate thermal extraction schemes, packaging and alignment of the multiple stacks, and appropriate micro-optical and optoelectronic component design.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sadik C. Esener and Philippe J. Marchand "3D optoelectronic stacked processors: design and analysis", Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); https://doi.org/10.1117/12.308872
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Cited by 16 scholarly publications.
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KEYWORDS
Optoelectronics

Packaging

Switches

Silicon

Computing systems

Very large scale integration

Image processing

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