Diamond windows for infrared and multispectral applications

Peter Koidl; Ch. Wild; Eckhard Woerner; W. Mueller-Sebert; M. Fuener; R. Locher

doi:10.1117/12.328035

26 October 1998 Diamond windows for infrared and multispectral applications

Peter Koidl, Ch. Wild, Eckhard Woerner, W. Mueller-Sebert, M. Fuener, R. Locher

Proceedings Volume 3436, Infrared Technology and Applications XXIV; (1998) https://doi.org/10.1117/12.328035
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1998, San Diego, CA, United States

Abstract

The low pressure deposition of polycrystalline diamond and the preparation of diamond windows at the Fraunhofer-IAF is reported. Using microwave plasma CVD, large area (2-6' diameter) diamond wafers with thicknesses of up to 2 mm have been grown. The deposition is carried out in a novel microwave plasma system which uses an ellipsoid cavity to generate very intense, spatially extended plasmas. Several of these plasma reactors with 6 to 60 kW microwave power are presnetly used at the IAF. The diamond wafers are ground and polished and laser- cut to the desired dimensions. To assess the optical and thermal properties, the residual absorption in the 10 micrometer range is determined by CO₂ laser calorimetry, and temperature dependent and spatially resolved measurements of the thermal conductivity are performed. In addition, thermal expansion and refractive index measurements as a function of temperature are reported. Using high-purity process gases and optimized CVD conditions, diamond windows with a residual absorption at 10.6 micrometer below 0.1 cm^-1 and a thermal conductivity over 20 W/cmK have been realized. In addition, low dielectric losses of tan(delta) equals 0.6 X 10^-4 at 140 GHz have been measured.

Citation Download Citation

Peter Koidl, Ch. Wild, Eckhard Woerner, W. Mueller-Sebert, M. Fuener, and R. Locher "Diamond windows for infrared and multispectral applications", Proc. SPIE 3436, Infrared Technology and Applications XXIV, (26 October 1998); https://doi.org/10.1117/12.328035

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