Taguchi method applied in optimization of Shipley SJR 5740 positive resist deposition

Allan P. Hui; Julian O. Blosiu; Dean V. Wiberg

doi:10.1117/12.312344

29 June 1998 Taguchi method applied in optimization of Shipley SJR 5740 positive resist deposition

Allan P. Hui, Julian O. Blosiu, Dean V. Wiberg

Proceedings Volume 3333, Advances in Resist Technology and Processing XV; (1998) https://doi.org/10.1117/12.312344
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

Taguchi methods of robust design presents a way to optimize output process performance through an organized set of experiments by using orthogonal arrays. Analysis of variance and signal-to-noise ratio is used to evaluate the contribution of each of the process controllable parameters in the realization of the process optimization. In the photoresist deposition process, there are numerous controllable parameters that can affect the surface quality and thickness of the final photoresist layer. To maximize the thickness and minimize the bubble formation of Shipley SJR 5740 photoresist (our optimum goal), eleven control parameters were selected and evaluated at two distinct levels. For a full factorial matrix experiment, 2048 experiments would have been necessary. Instead, by utilizing the orthogonal array concept, only 12 experiments were necessary for the optimization.

Citation Download Citation

Allan P. Hui, Julian O. Blosiu, and Dean V. Wiberg "Taguchi method applied in optimization of Shipley SJR 5740 positive resist deposition", Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); https://doi.org/10.1117/12.312344

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