Paper
21 November 1997 Three-dimensional thermal field analysis using a rotating interferometer
Zhengdong Wang, Dapeng Yan, Wei Yao, Anzhi He
Author Affiliations +
Abstract
A 3D thermal field has been analyzed using a rotating interferometer. By rotating, the interferometer the multi- direction interferograms of the tested field are captured by a CCD-computer system and stored into computer. After processing multi-direction interferograms by the image- processing and reconstruction software the multi-direction data are obtained. The multi-layer thermal field distributions are reconstructed using the same software. All process is finished within a few minutes and a complete 3D thermal field is obtained. The result is well fit to the conclusion gained by thermocouple.
© (1997) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhengdong Wang, Dapeng Yan, Wei Yao, and Anzhi He "Three-dimensional thermal field analysis using a rotating interferometer", Proc. SPIE 3172, Optical Technology in Fluid, Thermal, and Combustion Flow III, (21 November 1997); https://doi.org/10.1117/12.279737
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KEYWORDS
LCDs

Interferometers

Data processing

Image processing

Tomography

Computed tomography

3D metrology

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