Overview of recent Japanese activities in thermographic NDT

Takahide Sakagami; Keiji Ogura

doi:10.1117/12.271645

4 April 1997 Overview of recent Japanese activities in thermographic NDT

Takahide Sakagami, Keiji Ogura

Proceedings Volume 3056, Thermosense XIX: An International Conference on Thermal Sensing and Imaging Diagnostic Applications; (1997) https://doi.org/10.1117/12.271645
Event: AeroSense '97, 1997, Orlando, FL, United States

Abstract

In the past decade, nondestructive testing techniques using infrared thermography, i.e., thermographic NDT techniques, received a lot of attention in many engineering fields in Japan. The first national symposium that specialized in thermographic NDT techniques was held in Tokyo, Japan on November 28-29, 1995, organized by the Research and Technical Committee on Surface Method of the Japanese Society for Nondestructive Inspection (JSNDI). At this symposium, twenty eight presentations including two keynote addresses were given. Over three hundred thermography researchers and engineers (thermographers) attended the symposium. Further, an exhibition of newly developed equipment for infrared thermography featuring the equipment of eleven companies took place concurrently. This symposium played an important role as the first national symposium dedicated to sharing information, ideas and experiences about thermographic NDT among thermographers from both the user and supplier sides. Sessions within the symposium were as follows: Advances in Infrared Imaging Systems; Applications for Composite Materials and Coated Materials; Diagnosis of Equipment/Monitoring, Applications for Structural Materials; Backup Techniques for Thermographic NDT; Infrared Stress Measurement and Contact Problems. This paper briefly describes presentations given in the symposium.

Citation Download Citation

Takahide Sakagami and Keiji Ogura "Overview of recent Japanese activities in thermographic NDT", Proc. SPIE 3056, Thermosense XIX: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (4 April 1997); https://doi.org/10.1117/12.271645

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