60-nm copper lines produced by a lift-off technique with 5-keV electrons: experiment and simulation

Ulrich A. Jagdhold; Lothar Bauch; Monika Boettcher

doi:10.1117/12.275877

7 July 1997 60-nm copper lines produced by a lift-off technique with 5-keV electrons: experiment and simulation

Ulrich A. Jagdhold, Lothar Bauch, Monika Boettcher

Proceedings Volume 3049, Advances in Resist Technology and Processing XIV; (1997) https://doi.org/10.1117/12.275877
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

We present a lift-off technique based on a single layer resist system which produces sub-100 nm structures of a metallization layer using a low-voltage electron beam lithography. By using an accelerating voltage of 5 keV an undercut of the resist profile after electron beam lithography is used to interrupt the anisotropically deposited copper layer so that a lift-off process produces structures for metallization layers. The two dimensional simulation of the whole process is based on a Monte-Carlo electron scattering calculation to describe the electron exposure, a cell-removal-algorithm to obtain the resist profiles after wet development and a string-algorithm to simulate the copper deposition. By optimizing this process, where the simulation assists the experiment, structures down to 60 nm are fabricated.

Citation Download Citation

Ulrich A. Jagdhold, Lothar Bauch, and Monika Boettcher "60-nm copper lines produced by a lift-off technique with 5-keV electrons: experiment and simulation", Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); https://doi.org/10.1117/12.275877

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