Silicon wafer specifications and characterization capabilities: another perspective

Randal K. Goodall

doi:10.1117/12.256190

4 November 1996 Silicon wafer specifications and characterization capabilities: another perspective

Randal K. Goodall

Proceedings Volume 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays; (1996) https://doi.org/10.1117/12.256190
Event: SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, 1996, Denver, CO, United States

Abstract

Models are highlighted as the key, underpinning element of specification and characterization of silicon wafers in the semiconductor industry. The role of models in interconnecting specifications, metrology, and standards across the domains of processes, equipment, and materials is described. Examples of failing models and new model approaches are provided for lithographic flatness and particle detection.

Citation Download Citation

Randal K. Goodall "Silicon wafer specifications and characterization capabilities: another perspective", Proc. SPIE 2862, Flatness, Roughness, and Discrete Defect Characterization for Computer Disks, Wafers, and Flat Panel Displays, (4 November 1996); https://doi.org/10.1117/12.256190

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