Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines

Tom Batchelder

doi:10.1117/12.931885

28 July 1981 Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines

Tom Batchelder

Proceedings Volume 0275, Semiconductor Microlithography VI; (1981) https://doi.org/10.1117/12.931885
Event: 1981 Microlithography Conferences, 1981, San Jose, United States

Abstract

Two of the most challenging problems confronting processes aimed at 2μm pitch minimum geometries are: imaging on highly reflective,grainy metals and the subsequent anisotropic plasma etch of aluminum or aluminum alloys. Metal lift off processes can eliminate these difficulties altogether by reversing the normal procedure for metalization. "Metal Lift Off" refers to processes in which the metal or metal alloy layer is deposited over the photoresist image and then the unwanted metal is removed by dissolving away the photoresist and lifting off the excess metal by suitable mechanical means (Fig. 1).

Citation Download Citation

Tom Batchelder "Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines", Proc. SPIE 0275, Semiconductor Microlithography VI, (28 July 1981); https://doi.org/10.1117/12.931885

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available