Wavelength division multiplexing using 3D interconnection structures

David M. Reinker

doi:10.1117/12.238907

1 May 1996 Wavelength division multiplexing using 3D interconnection structures

David M. Reinker

Proceedings Volume 2690, Wavelength Division Multiplexing Components; (1996) https://doi.org/10.1117/12.238907
Event: Photonics West '96, 1996, San Jose, CA, United States

Abstract

Semiconductor edge emitting lasers are passively aligned to polymeric waveguides on high thermal conductivity substrates. The single mode waveguides are combined to provide a high bandwidth wavelength division multiplexed channel. 3D stacks of the substrates are interconnected electrically and optically for further multiplexing.

Citation Download Citation

David M. Reinker "Wavelength division multiplexing using 3D interconnection structures", Proc. SPIE 2690, Wavelength Division Multiplexing Components, (1 May 1996); https://doi.org/10.1117/12.238907

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