Fiber optic MCM for spaceborne applications

Julian P. G. Bristow; John A. Lehman; Yue Liu; W. Tim Goldberg; John L. DeRuiter; Dennis Kersch

doi:10.1117/12.177630

8 June 1994 Fiber optic MCM for spaceborne applications

Julian P. G. Bristow, John A. Lehman, Yue Liu, W. Tim Goldberg, John L. DeRuiter, Dennis Kersch

Author Affiliations +

Proceedings Volume 2215, Photonics for Space Environments II; (1994) https://doi.org/10.1117/12.177630
Event: SPIE's International Symposium on Optical Engineering and Photonics in Aerospace Sensing, 1994, Orlando, FL, United States

Abstract

This paper presents a fiber optic packaging technique using qualifiable materials and processes that has been developed for space applications. The technique is consistent with a Multi Chip Module implementation. This packaging technique allows multiple fiber optic interfaces to be combined with high density electronics within a single easily integrable package and can be used wherever fiber optics are incorporated into spaceborne systems, including the Fiber Optic Data Bus, the Space Station FDDI interface, any upgrades of the Space Station Local Bus from 1553 to 1773, and various Dual Rate 1773 applications.

Citation Download Citation

Julian P. G. Bristow, John A. Lehman, Yue Liu, W. Tim Goldberg, John L. DeRuiter, and Dennis Kersch "Fiber optic MCM for spaceborne applications", Proc. SPIE 2215, Photonics for Space Environments II, (8 June 1994); https://doi.org/10.1117/12.177630

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