Paper
11 March 1994 Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints
Paul A. Roder
Author Affiliations +
Proceedings Volume 2183, Machine Vision Applications in Industrial Inspection II; (1994) https://doi.org/10.1117/12.171225
Event: IS&T/SPIE 1994 International Symposium on Electronic Imaging: Science and Technology, 1994, San Jose, CA, United States
Abstract
Learning algorithms are introduced for use in the inspection of cross-sectional X-ray images of solder joints. These learning algorithms improve measurement accuracy by accounting for localized shading effects that can occur when inspecting double- sided printed circuit board assemblies. Two specific examples are discussed. The first is an algorithm for detection of solder short defects. The second algorithm utilizes learning to generate more accurate statistical process control measurements.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul A. Roder "Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints", Proc. SPIE 2183, Machine Vision Applications in Industrial Inspection II, (11 March 1994); https://doi.org/10.1117/12.171225
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Cited by 2 scholarly publications.
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KEYWORDS
X-rays

Inspection

X-ray imaging

Detection and tracking algorithms

Capacitors

Opacity

Defect detection

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