High-speed optoelectronic multichip modules packaged in glass on silicon

Stavros Iezekiel; Eric A. Soshea; Matthew F. J. O'Keefe; Christopher M. Snowden

doi:10.1117/12.175260

2 May 1994 High-speed optoelectronic multichip modules packaged in glass on silicon

Stavros Iezekiel, Eric A. Soshea, Matthew F. J. O'Keefe, Christopher M. Snowden

Proceedings Volume 2149, Technologies for Optical Fiber Communications; (1994) https://doi.org/10.1117/12.175260
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

Future communication and computer systems will require major advances in the integration of optical, optoelectronic and high- speed electronic componenets if packaging costs are to be reduced to acceptable levels. A hybrid integration approach called optoelectroic glass microwave integrated circuit (opto-GMIC) has been developed. Opto-GMIC comprises a glass substrate on a silicon carrier which can accommodate discrete and monolithic microwave and optoelectronic devices. In addition, fibre alignment grooves that simplify pigtailing can be defined. Hence a wide variety of high-speed optoelectronic multichip module designs can ultimately be produced from the same production line. In contrast to rival monolithic optoelectronic integrated circuit (OEIC) technologies, opto-GMIC can interconnect devices fabricated from different materials. This feature has been demonstrated by the fabrication of prototype fibre-optic repeaters, transmitters and receivers. These modules are designed for synchronous optical network (SONET) applications at a bit rate of 622.08 Mb/s and at a wavelength of 1.3 micrometers . All electronic functions on the modules are performed by GaAs microwave monolithic integrated circuits (MMICs) while optoelectronic functions are provided by InGaAs photodiodes and InGaAsP laser diodes. By off-loading electronic passive elements onto glass, the number of parts in assembly is reduced drastically.

Citation Download Citation

Stavros Iezekiel, Eric A. Soshea, Matthew F. J. O'Keefe, and Christopher M. Snowden "High-speed optoelectronic multichip modules packaged in glass on silicon", Proc. SPIE 2149, Technologies for Optical Fiber Communications, (2 May 1994); https://doi.org/10.1117/12.175260

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