Paper
15 September 1993 Effect of using a resin coating on KrF chemically amplified positive resists
Akira Oikawa, Nobuaki Santoh, Shuichi Miyata, Yasunori Hatakenaka, Hiroyuki Tanaka, Kenji Nakagawa
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Abstract
We tried several resins to protect chemically amplified positive resists from contaminants such as ammonia and amines. Polymethyl silsesquioxane (PMSS), a hydrophobic resin, significantly reduced the severity of T-tops and improved delay-time stability. Polyolefinic resin (POR) was the most effective hydrophobic resin and improved the performance of all chemically amplified resists we tried. The pattern profiles were not significantly affected by the protective resin thickness; resin films from 400 angstroms to 9500 angstroms were equally effective. We also used resin coatings to identify when resists are contaminated. We found that contamination begins just after exposure and continues to the end of postexposure bake (PEB).
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akira Oikawa, Nobuaki Santoh, Shuichi Miyata, Yasunori Hatakenaka, Hiroyuki Tanaka, and Kenji Nakagawa "Effect of using a resin coating on KrF chemically amplified positive resists", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154809
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Cited by 8 scholarly publications.
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KEYWORDS
Coating

Contamination

Polymers

Chemically amplified resists

Control systems

Excimer lasers

Lithography

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