Deep-UV resists with improved delay capabilities

Dirk J. H. Funhoff; H. Binder; Reinhold Schwalm

doi:10.1117/12.59725

1 June 1992 Deep-UV resists with improved delay capabilities

Dirk J. H. Funhoff, H. Binder, Reinhold Schwalm

Proceedings Volume 1672, Advances in Resist Technology and Processing IX; (1992) https://doi.org/10.1117/12.59725
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

In this paper, we present our approaches to solve the delay problem, i.e., the formation of T- tops during the delay time between exposure and post-exposure bake. We investigated the distribution of the photoacid generator in the resist layer and the influence of basic contaminations in the formulation. T-topped patterns can be avoided by using appropriate developers. The incorporation of additives make the resist less sensitive to basic contaminations. Some formulations show no T-top formation under severe conditions for a considerable amount of time.

Citation Download Citation

Dirk J. H. Funhoff, H. Binder, and Reinhold Schwalm "Deep-UV resists with improved delay capabilities", Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); https://doi.org/10.1117/12.59725

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