Cumulative effect and cutting quality improvement of XeCl laser ablation of PMMA

Qihong Lou; Hongping Guo

doi:10.1117/12.51041

1 December 1991 Cumulative effect and cutting quality improvement of XeCl laser ablation of PMMA

Qihong Lou, Hongping Guo

Proceedings Volume 1598, Lasers in Microelectronic Manufacturing; (1991) https://doi.org/10.1117/12.51041
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States

Abstract

In this paper, the ablation processes were investigated using light deflection spectroscopy as a detection method. The cumulative effect of PMMA near the ablation threshold was studied in detail, and the cutting-edge quality of photoablation was improved to some extent by a nitrogen gas stream.

Citation Download Citation

Qihong Lou and Hongping Guo "Cumulative effect and cutting quality improvement of XeCl laser ablation of PMMA", Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); https://doi.org/10.1117/12.51041

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