Low-temperature deformation measurement of materials by the use of laser speckle photography method

Sumio Nakahara; Shigeyoshi Hisada; Takeyoshi Fujita; Kiyoshi Sugihara

doi:10.1117/12.49500

1 December 1991 Low-temperature deformation measurement of materials by the use of laser speckle photography method

Sumio Nakahara, Shigeyoshi Hisada, Takeyoshi Fujita, Kiyoshi Sugihara

Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991) https://doi.org/10.1117/12.49500
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

The laser speckle photography method is applied to study the deformation behavior of aluminum, stainless steel and high-purity alumina ceramics specimens during the cooling down process from the room to the liquid nitrogen temperatures. The in-plane displacements were measured by the image plane speckle photography and the out-of-plane displacements by the defocused speckle photography, respectively. The surface of ceramics specimen was coated with vacuum-evaporated aluminum film to keep the correlation of speckle patterns during the cooling down process. The experimental values of the in-plane displacement are compared with those of the FEM thermal analysis. The applicability of laser speckle photography method to cryogenic engineering is discussed.

Citation Download Citation

Sumio Nakahara, Shigeyoshi Hisada, Takeyoshi Fujita, and Kiyoshi Sugihara "Low-temperature deformation measurement of materials by the use of laser speckle photography method", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.49500

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