Characterization of automatic overlay measurement technique for sub-half-micron devices

Akira Kawai; Keiji Fujiwara; Kouichirou Tsujita; Hitoshi Nagata

doi:10.1117/12.44441

1 July 1991 Characterization of automatic overlay measurement technique for sub-half-micron devices

Akira Kawai, Keiji Fujiwara, Kouichirou Tsujita, Hitoshi Nagata

Proceedings Volume 1464, Integrated Circuit Metrology, Inspection, and Process Control V; (1991) https://doi.org/10.1117/12.44441
Event: Microlithography, 1991, San Jose, CA, United States

Abstract

Measurement precision, especially the measurement offset of an automatic overlay measurement technique, was studied for application to sub-half micron device manufacturing. Experimental data showed that the measurement offset depended on the cross-section structure rather than the reflectivity or the roughness of the overlay marks. Dependence of the measurement offset upon equipment factors such as the incident angle of illumination was also studied. This paper also shows measurement offsets on critical levels of the sub-half micron device manufacturing.

Citation Download Citation

Akira Kawai, Keiji Fujiwara, Kouichirou Tsujita, and Hitoshi Nagata "Characterization of automatic overlay measurement technique for sub-half-micron devices", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); https://doi.org/10.1117/12.44441

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