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10 December 2024 Edge placement error analysis through backscattered electron imaging
Yuyang Bian, Na Li, Wenzhan Zhou, Biqiu Liu, Yu Zhang, Rong Huang, Jiawang Song, Qiang Zhou, Siqun Xiao, Or Zruya, Lee Rubinstein, Aner Avakrat, Jovian Delaforce, Antoine Legrain, Qing Ye, Frederic Roberten, Amir Rosen, Michael Shifrin
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Proceedings Volume 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024); 134230C (2024) https://doi.org/10.1117/12.3052520
Event: 8th International Workshop on Advanced Patterning Solutions (IWAPS 2024), 2024, Jiaxing, Zhejiang, China
Abstract
Edge placement error (EPE) has become a critical metric for ensuring patterning accuracy and optimizing the process window in semiconductor manufacturing. Initially introduced to measure optical proximity correction (OPC) errors, EPE now encompasses a broader set of parameters, including overlay (OV), critical dimension uniformity (CDU), and line width roughness (LWR), making it essential for managing the complexity of advanced multi-patterning processes. Despite its importance, directly measuring EPE remains challenging due to the intricate nature of modern semiconductor devices, often requiring statistical methods for estimation. This paper demonstrates the use of secondary electron (SE) and backscattered electron (BSE) imaging to improve the accuracy and practicality of EPE measurement. By optimizing BSE imaging conditions, layers such as contact and can be visualized simultaneously, allowing for more direct calculations of OV and EPEinterlayer. The optimized imaging conditions also enhance edge definition, improving pattern accuracy and process control. Our results show that SE and BSE imaging offer a more precise method for evaluating EPE and contribute to a better understanding of the factors influencing process window control.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Yuyang Bian, Na Li, Wenzhan Zhou, Biqiu Liu, Yu Zhang, Rong Huang, Jiawang Song, Qiang Zhou, Siqun Xiao, Or Zruya, Lee Rubinstein, Aner Avakrat, Jovian Delaforce, Antoine Legrain, Qing Ye, Frederic Roberten, Amir Rosen, and Michael Shifrin "Edge placement error analysis through backscattered electron imaging", Proc. SPIE 13423, Eighth International Workshop on Advanced Patterning Solutions (IWAPS 2024), 134230C (10 December 2024); https://doi.org/10.1117/12.3052520
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KEYWORDS
Optical lithography
Statistical analysis
Process control
Semiconductor manufacturing
Line width roughness
Scanning electron microscopy
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