Research on twist detection of electroplated diamond wire saw based on machine vision

Chenxi Zhou; Peiqi Ge; Wenbo Bi; Yukang Zhao; Jintao Zheng

doi:10.1117/12.3038631

23 August 2024 Research on twist detection of electroplated diamond wire saw based on machine vision

Chenxi Zhou, Peiqi Ge, Wenbo Bi, Yukang Zhao, Jintao Zheng

Proceedings Volume 13250, Fourth International Conference on Image Processing and Intelligent Control (IPIC 2024); 132502O (2024) https://doi.org/10.1117/12.3038631
Event: 4th International Conference on Image Processing and Intelligent Control (IPIC 2024), 2024, Kuala Lumpur, Malaysia

Abstract

Electroplated diamond wire saw is widely used in photovoltaic, wafer, and other industries in the field of slicing processing, but in the sawing process the twist of the wire saw will have an impact on the quality of the slicing process and the life of the wire saw, to detect the twist of the electroplated diamond wire saw, the electroplated diamond wire saw twist detection method based on machine vision is proposed. A high frame rate CCD camera is used to acquire the surface image of the electroplated diamond wire saw, and the half-cylindrical image of the wire saw is expanded to mention the coordinates of its feature points, and the twist angle of the wire saw is calculated by the change of the position of the same feature point between the neighboring frames of the image. The results show that the maximum relative deviation of the twist angle of the electroplated diamond wire saw based on machine vision is 3.8%, and the relative deviation of the average value is 1.8%, which is capable of realizing high-precision, high-efficiency, and low-cost detection of the twist angle of the electroplated diamond wire saw, and providing a detection basis for controlling the twist of the electroplated diamond wire saw.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Chenxi Zhou, Peiqi Ge, Wenbo Bi, Yukang Zhao, and Jintao Zheng "Research on twist detection of electroplated diamond wire saw based on machine vision", Proc. SPIE 13250, Fourth International Conference on Image Processing and Intelligent Control (IPIC 2024), 132502O (23 August 2024); https://doi.org/10.1117/12.3038631

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KEYWORDS

Diamond

Cameras

Abrasives

Image processing

CCD cameras

Machine vision

Image acquisition

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