Surface roughness of microfabrication and its influence on integrated interconnect transmission loss

Yang Liu; Shengying Zou; Xuyao Zhang; Bin Liu; Jie Lin; Peng Jin

doi:10.1117/12.3038258

5 August 2024 Surface roughness of microfabrication and its influence on integrated interconnect transmission loss

Yang Liu, Shengying Zou, Xuyao Zhang, Bin Liu, Jie Lin, Peng Jin

Author Affiliations +

Proceedings Volume 13226, Third International Conference on Advanced Manufacturing Technology and Manufacturing Systems (ICAMTMS 2024); 132262Y (2024) https://doi.org/10.1117/12.3038258
Event: 3rd International Conference on Advanced Manufacturing Technology and Manufacturing Systems (ICAMTMS 2024), 2024, Changsha, China

Abstract

Here, the disparity in metal surface roughness and its impact on loss is investigated for the integrated interconnection of optoelectronic devices fabricated by wafer-level multilayer metal-air-dielectric additive-manufacturing technology. The metal surface roughness and its influence on integrated interconnect transmission loss was analyzed. According to the different contact materials and post-treatment technique, a variety of metal surface models were established. The metal surface roughness of the fabricated samples was measured, and the influence of the micro-machining process was verified. Meanwhile, micro-coaxial transmission lines are employed as the research object to validate the mechanism of surface roughness affecting transmission loss. The measured results of the transmission line samples are well consistent with the finite element simulation results by considering the actual metal roughness.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yang Liu, Shengying Zou, Xuyao Zhang, Bin Liu, Jie Lin, and Peng Jin "Surface roughness of microfabrication and its influence on integrated interconnect transmission loss", Proc. SPIE 13226, Third International Conference on Advanced Manufacturing Technology and Manufacturing Systems (ICAMTMS 2024), 132262Y (5 August 2024); https://doi.org/10.1117/12.3038258

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