Estimation of hardware-failure rates using IR thermography

Angel Madrid

doi:10.1117/12.21906

1 March 1990 Estimation of hardware-failure rates using IR thermography

Angel Madrid

Proceedings Volume 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications; (1990) https://doi.org/10.1117/12.21906
Event: 1990 Technical Symposium on Optics, Electro-Optics, and Sensors, 1990, Orlando, FL, United States

Abstract

A methodology based on IR Thermography measurements is proposed to estimate real istic values of hardware failure rates corresponding to secondary failures that is those caused by past or present outoftolerance or abnormal operating conditions. The methodology allows the establishment of useful correlations between these failure rates and the corresponding relevant thermal patterns as mapped using IR Thermography. The methodology is applied to practical cases of secondary failures in typical electrical and mechanical components having to do with failure modes due to abnormal stress corrosion and friction. The application of this technique to fault and failure diagnosis and both Reliability Availability and Maintainability (RAM) Analysis and Probabilistic Risk Assessment (PEA) is also briefly discussed. 1.

Citation Download Citation

Angel Madrid "Estimation of hardware-failure rates using IR thermography", Proc. SPIE 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (1 March 1990); https://doi.org/10.1117/12.21906

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