An overview of semiconductor industry efforts to reduce PFAS use and emissions in plasma processes

Laurie S. Beu; Melissa A. Gresham

doi:10.1117/12.3013226

9 April 2024 An overview of semiconductor industry efforts to reduce PFAS use and emissions in plasma processes

Laurie S. Beu, Melissa A. Gresham

Proceedings Volume 12958, Advanced Etch Technology and Process Integration for Nanopatterning XIII; 129580M (2024) https://doi.org/10.1117/12.3013226
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Per- and polyfluoroalkyl substances or PFAS have faced increased scrutiny because they are environmentally persistent and certain PFAS have also been found to be bioaccumulative and toxic. In recent years, PFAS chemistries have been grouped as a class based on chemical structure rather than physical and chemical properties or environmental and human health considerations. This class definition has brought into scope many fluorocarbons found in semiconductor manufacturing, including the fluoropolymers used to ensure safe handling and distribution of chemicals and gases, as well as perfluorocarbon (PFC) and hydrocarbon (HFC) gases used in plasma etch processes. This paper will present a historical perspective of the semiconductor industry’s efforts to reduce F-GHG consumption and emissions. It will conclude with an overview of the work of the Semiconductor PFAS Consortium and their plasma etch and deposition working group.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Laurie S. Beu and Melissa A. Gresham "An overview of semiconductor industry efforts to reduce PFAS use and emissions in plasma processes", Proc. SPIE 12958, Advanced Etch Technology and Process Integration for Nanopatterning XIII, 129580M (9 April 2024); https://doi.org/10.1117/12.3013226

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