Full-wafer, maskless patterning with sub-50nm resolution and large depth-of-focus enabled by multicolumn electron beam lithography

Andrew C. Ceballos; Kenneth P. MacWilliams; Ted A. Prescop; Roderick J. Loewen

doi:10.1117/12.3010903

9 April 2024 Full-wafer, maskless patterning with sub-50nm resolution and large depth-of-focus enabled by multicolumn electron beam lithography

Andrew C. Ceballos, Kenneth P. MacWilliams, Ted A. Prescop, Roderick J. Loewen

Author Affiliations +

Proceedings Volume 12956, Novel Patterning Technologies 2024; 129560S (2024) https://doi.org/10.1117/12.3010903
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

Multibeam Corporation is redefining electron beam lithography with its groundbreaking Multicolumn Electron Beam Lithography (MEBL) systems. These fully automated tools utilize an array of miniaturized electron columns and sophisticated algorithms to achieve high-speed, high-resolution patterning across the entire wafer. This innovative maskless technology enables extraordinary design flexibility, accelerating learning cycles and speeding time to market for advanced chip designs. MEBL's high throughput and adaptability empower foundries to rapidly explore new ideas, making possible a new generation of customized semiconductor products. Designed with the capability to complement and bolster photolithography processes, this maskless manufacturing approach further accelerates time to market and significantly reduces costs, particularly for low-volume, high-mix production.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Andrew C. Ceballos, Kenneth P. MacWilliams, Ted A. Prescop, and Roderick J. Loewen "Full-wafer, maskless patterning with sub-50nm resolution and large depth-of-focus enabled by multicolumn electron beam lithography", Proc. SPIE 12956, Novel Patterning Technologies 2024, 129560S (9 April 2024); https://doi.org/10.1117/12.3010903

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