Advanced overlay metrology for wafer bonding applications

Tomohiro Goto; Yoshimitsu Kato; Takashi Koike; Kentaro Kasa; Yusuke Tanaka; Akihiro Nakae

doi:10.1117/12.3010317

9 April 2024 Advanced overlay metrology for wafer bonding applications

Tomohiro Goto, Yoshimitsu Kato, Takashi Koike, Kentaro Kasa, Yusuke Tanaka, Akihiro Nakae

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 129550T (2024) https://doi.org/10.1117/12.3010317
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Abstract

Wafer bonding technology is one of the key processes for high density and high performance semiconductor devices. However, bonding pads could not be directly observed with visible light after wafer bonding because of the thick silicon substrate. In this paper, we demonstrated high-precision bonding overlay control techniques using a bonding machine, an advanced process control (APC) system, and a newly developed overlay measurement tool that uses infrared (IR) light. The accuracy of the IR-light overlay measurement was verified by using a conventional visible-light tool after back-side silicon removal. The verification results showed good measurement repeatability and accuracy of the IR-light measurement which can be performed right after wafer bonding.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Tomohiro Goto, Yoshimitsu Kato, Takashi Koike, Kentaro Kasa, Yusuke Tanaka, and Akihiro Nakae "Advanced overlay metrology for wafer bonding applications", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129550T (9 April 2024); https://doi.org/10.1117/12.3010317

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