Electrically conductive polymer-graphene composite material for selective laser sintering additive manufacturing

Luke Bond; Henrik Andersson; Jonas Örtegren; Magnus Larsson; Magnus Engholm

doi:10.1117/12.3003049

12 March 2024 Electrically conductive polymer-graphene composite material for selective laser sintering additive manufacturing

Luke Bond, Henrik Andersson, Jonas Örtegren, Magnus Larsson, Magnus Engholm

Author Affiliations +

Proceedings Volume 12873, Laser-based Micro- and Nanoprocessing XVIII; 1287317 (2024) https://doi.org/10.1117/12.3003049
Event: SPIE LASE, 2024, San Francisco, California, United States

Conference Poster

Abstract

Additive manufacturing is rapidly growing, where selective laser sintering technology dominates for industrial use. In the case of polymer selective laser sintering, polyamide is the standard material. However, polyamide is an electrical insulator, and for specific applications, it would be desirable to be able to manufacture polymer-based electrically conductive parts. Electromagnetic compatibility is one of the most significant targeted applications, where the introduction of electric vehicles raises new electromagnetic compatibility demands. The goal is, therefore, to develop an electrically conductive composite material for selective laser sintering using graphene as the additive. Composites are prepared by mixing polyamide, graphene, and additives with varying graphene/polyamide ratios. The aim of this investigation is the laser-assisted processing of the resulting graphene/polyamide composites with various parameters to sinter the material, forming a solid conductive structure. The structure is characterized using SEM and resistance measurements. Results show sheet resistance values of about 700Ω/sq after laser-assisted processing with good powder flowability.

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Luke Bond, Henrik Andersson, Jonas Örtegren, Magnus Larsson, and Magnus Engholm "Electrically conductive polymer-graphene composite material for selective laser sintering additive manufacturing", Proc. SPIE 12873, Laser-based Micro- and Nanoprocessing XVIII, 1287317 (12 March 2024); https://doi.org/10.1117/12.3003049

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