Presentation + Paper
21 November 2023 EUV APSM mask prospects and challenges
Author Affiliations +
Abstract
The high numerical aperture EUV exposure systems aim to target a 16-nm pitch to extend Moore's law throughout the next decade. However, thinner photoresist layers and worsened stochastic effects due to photons hitting the wafer at a shallower angle is a major concern. Furthermore, the projection optics utilize an anisotropic reduction factor, which remains an open issue, requiring a dual "half-field" mask exposure sequence or a 12-inch mask for each high-NA EUV layer. Therefore, the use of attenuated phase-shift masks (APSM) to extend 0.33NA to a 28-nm pitch becomes relevant. We will discuss the prospects on optical properties refractive index (n,k) optimization with material selection, feasibility of achieving a 28-nm pitch, 3D effect mitigation and the impact of mask tonality (dark tone vs clear tone). Finally, the challenges on the needs of new APSM materials that meet the requirements of high temp thermal stability, durability under mask clean solution, its dry etching characteristics, the corresponding repair process will be addressed and the experimental results on the Ru-based candidates will be shown.
Conference Presentation
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Shy-Jay Lin, Chien-Min Lee, Yen-Liang Chen, Kuo-Lun Tai, Lee-Feng Chen, Chien-Chao Huang, and Frankie F. G. Tsai "EUV APSM mask prospects and challenges", Proc. SPIE 12751, Photomask Technology 2023, 127510N (21 November 2023); https://doi.org/10.1117/12.2688111
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KEYWORDS
3D mask effects

Extreme ultraviolet

Extreme ultraviolet lithography

Photons

Photoresist materials

Projection systems

Refractive index

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