Design of Xilinx Zynq UltraScale+ MPSoC special power module

Yan Wang; Yahui Zhang

doi:10.1117/12.2684574

19 October 2023 Design of Xilinx Zynq UltraScale+ MPSoC special power module

Yan Wang, Yahui Zhang

Proceedings Volume 12709, Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023); 127091O (2023) https://doi.org/10.1117/12.2684574
Event: Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), 2023, Nanjing, China

Abstract

MPSOC chip is the heterogeneous multiprocessing platform chip with the most extensive application and the highest stability in the global market. It has important applications in artificial intelligence, autonomous driving, and other fields. The MPSOC has a flexible power domain inside, and multiple power rails make its dedicated power module design very important. As long as the accuracy of the power supply is guaranteed, the safety of the chip can be guaranteed. A new power module is designed through the combination of DCDC, LDO, and PMIC to make the power supply more flexible and reliable and to provide more security for the application of MPSOC.

Citation Download Citation

Yan Wang and Yahui Zhang "Design of Xilinx Zynq UltraScale+ MPSoC special power module", Proc. SPIE 12709, Fourth International Conference on Artificial Intelligence and Electromechanical Automation (AIEA 2023), 127091O (19 October 2023); https://doi.org/10.1117/12.2684574

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