Paper
31 May 2023 Portable package detection imaging method based on planar ECT technology
Yongbo He, Zhaoyang Chen, Shuhao Zhang
Author Affiliations +
Proceedings Volume 12704, Eighth International Symposium on Advances in Electrical, Electronics, and Computer Engineering (ISAEECE 2023); 1270412 (2023) https://doi.org/10.1117/12.2680501
Event: 8th International Symposium on Advances in Electrical, Electronics and Computer Engineering (ISAEECE 2023), 2023, Hangzhou, China
Abstract
In order to realize the rapid detection and imaging of dangerous goods with high dielectric constant at small and mediumsized express points, a three-dimensional imaging method for packaging inspection based on planar ECT technology was proposed; Firstly, the electrode matrix of traditional planar ECT is optimized, and a planar ECT sensor with linear detection electrode array is designed; Then, the simulation model of the package to be tested under different dielectric constants is established. During the detection, the electrode plate is placed on the top of the package and moved slowly to obtain the capacitance signal of the detection electrode plate in different areas of the package; Finally, the iso-surface method is used for partial and full 3D imaging of the object in the package. The experimental results show that the designed detection method can realize three-dimensional imaging of high water content in packaging and metal dangerous goods.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yongbo He, Zhaoyang Chen, and Shuhao Zhang "Portable package detection imaging method based on planar ECT technology", Proc. SPIE 12704, Eighth International Symposium on Advances in Electrical, Electronics, and Computer Engineering (ISAEECE 2023), 1270412 (31 May 2023); https://doi.org/10.1117/12.2680501
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KEYWORDS
Electrodes

Dielectrics

Stereoscopy

Capacitance

Sensors

Electric fields

Tomography

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