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We report on a new manufacturing paradigm to build scalable microbolometers at the lowest cost possible. A VGA microbolometer focal plane array has been designed and fabricated using flat panel display production tools, using the Large Area MEMS Platform (LAMP). Complex MEMs sensors have been integrated with Low Temperature Polysilicon (LTPS) transistors on a Gen 3.5 glass substrate in a display production fab to realize an order of magnitude gain in the number of devices per substrate. In this modular approach, a custom readout integrated circuit (ROIC) is bonded to the glass focal plane with the Chip on Flex (COF) technique, a high volume and low-cost staple of the display industry. We discuss the potential implications of the pricing disruption to important commercial applications.
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John Hong, Sean Andrews, Edward Chan, Tallis Chang, Yaoling Pan, Heesun Shin, Bing Wen, "Achieving unprecedented scale and cost effectiveness with microbolometers on glass," Proc. SPIE 12534, Infrared Technology and Applications XLIX, 125341E (13 June 2023); https://doi.org/10.1117/12.2666249