Paper
27 April 2023 Advanced high-voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement
Author Affiliations +
Abstract
High voltage scanning electron microscopy (HV-SEM) has recently been adopted as an on-device overlay metrology tool. However, the chip-manufacturing industry requests more advanced tools capable of low-distortion imaging and versatile measurement functionality for multi-layer processing. We developed a high voltage e-beam inspection (HV-EBI) tool for on-device overlay metrology that fills the abovementioned requirement. The HV-EBI tool has the capability of variable acceleration voltage in the range of 30kV to 50kV and wide field of view (FOV) imaging up to a maximum of 50μm with extremely low first-order distortion in the level of <0.01% and 0.1mrad and uniform in-plane beam perpendicularity. In this paper, we demonstrate the performance of on-device overlay measurement by using the proposed HV-EBI tool combined with enhanced die-to-database (D2DB) algorithm and image processor.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seulki Kang, Kotaro Maruyama, Yuichiro Yamazaki, Matteo Beggiato, Anabela Veloso, and Gian Lorusso "Advanced high-voltage e-beam system combined with an enhanced D2DB for on-device overlay measurement", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124961W (27 April 2023); https://doi.org/10.1117/12.2661180
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Overlay metrology

Image processing

Distortion

Computer aided design

Design and modelling

Imaging systems

Image enhancement

RELATED CONTENT


Back to Top