Additive manufacturing of metal interconnects using microscale selective laser sintering

Aaron Liao; Joshua Grose; Farzana Tasnim; Michael Cullinan

doi:10.1117/12.2655264

15 March 2023 Additive manufacturing of metal interconnects using microscale selective laser sintering

Aaron Liao, Joshua Grose, Farzana Tasnim, Michael Cullinan

Proceedings Volume 12410, Nanoscale and Quantum Materials: From Synthesis and Laser Processing to Applications 2023; 1241005 (2023) https://doi.org/10.1117/12.2655264
Event: SPIE LASE, 2023, San Francisco, California, United States

Abstract

Microscale selective laser sintering (μ-SLS) is a high throughput additive manufacturing (AM) technique developed at The University of Texas at Austin. It can fabricate high aspect ratio metal interconnect structures such as micro-pillar arrays for applications in semiconductor packaging. Additionally, as an AM process, μ-SLS aims to create complex 3D structures at a throughput that cannot be achieved by multi-step lithography processes.

Conference Presentation

Citation Download Citation

Aaron Liao, Joshua Grose, Farzana Tasnim, and Michael Cullinan "Additive manufacturing of metal interconnects using microscale selective laser sintering", Proc. SPIE 12410, Nanoscale and Quantum Materials: From Synthesis and Laser Processing to Applications 2023, 1241005 (15 March 2023); https://doi.org/10.1117/12.2655264

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available