Epi-down mounting can degrade performance in broad area lasers when the stress field extends into the active region. Thick p-side epitaxial layers have the potential to isolate the device from external stress, but add electrical resistance and losses from current spreading. Therefore, we use two-step epitaxy to combine highly-doped p-side epitaxial layers (2x thicker than conventional) with a resistive oxygen-implanted layer located close to the active region to block lateral current spreading. The resulting buried-regrown-implant-structure (BRIS) lasers with 100 μm stripes and lasing wavelength of 915 nm show high efficiency (peak of 67%, 55% at 20 W) and high lateral brightness (3.3 W/mm·mrad up to 17.5 W output power), improved over reference devices, in spite of the thick p-side.
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