Presentation + Paper
27 May 2022 Thermal imaging and simulation of a droplet on a hydrophobic substrate
Shuji Kamegaki, Meguya Ryu, Junko Morikawa
Author Affiliations +
Abstract
Relation between evaporation rate and temperature change due to latent heat is investigated with thermal imaging in micro scale and a numerical simulation. Evaporation involves many complicated phenomena, in addition to vapor diffusion in the air. The surface of droplet is cooled during evaporation due to the latent heat, and the cooling has great influence on the evaporation rate. Therefore, heat and mass transfer phenomena are strong-coupled problem. Numerical simulation model to reproduce evaporation phenomenon is desired to investigate the complicated phenomenon, and heat and mass transfer equations are solved with CFD tool: openFOAM. The influences of evaporative cooling on the evaporation rate have been investigated with various droplet sizes and various contact radii. The temperature on the surface of evaporation of a water droplet was measured with a microscopic infrared imaging and a micro probe sensor with a thermoelectric hot junction.
Conference Presentation
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Shuji Kamegaki, Meguya Ryu, and Junko Morikawa "Thermal imaging and simulation of a droplet on a hydrophobic substrate", Proc. SPIE 12109, Thermosense: Thermal Infrared Applications XLIV, 121090N (27 May 2022); https://doi.org/10.1117/12.2622986
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KEYWORDS
Temperature metrology

Diffusion

Thermography

Infrared cameras

Sensors

Infrared imaging

Inkjet technology

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