Advancement in optical interconnect technology for high speed data transmission

Tiger Ninomiya; Bernard H. L. Lee; Richard Pitwon

doi:10.1117/12.2609301

5 March 2022 Advancement in optical interconnect technology for high speed data transmission

Tiger Ninomiya, Bernard H. L. Lee, Richard Pitwon

Proceedings Volume 12007, Optical Interconnects XXII; 120070R (2022) https://doi.org/10.1117/12.2609301
Event: SPIE OPTO, 2022, San Francisco, California, United States

Abstract

Optical communication roadmaps have been moved forward 3-4 years by the critical need for remote working during the pandemic. The development of 800 Gb/s and 1.6 Tb/s technologies exceeds original projections with the first co-packaged optical modules anticipated in 2023. Furthermore, advances in quantum computing and quantum communication are creating a demand for new “quantum grade” optical fiber interconnect to support quantum networks and connectivity to quantum photonic integrated circuits. In this paper, we report on the latest advances in optical interconnect required to enable the proliferation of co-packaged optics, quantum networks and quantum photonic integrated circuits.

Conference Presentation

Citation Download Citation

Tiger Ninomiya, Bernard H. L. Lee, and Richard Pitwon "Advancement in optical interconnect technology for high speed data transmission", Proc. SPIE 12007, Optical Interconnects XXII, 120070R (5 March 2022); https://doi.org/10.1117/12.2609301

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