Fabrication of platinum microstructures for sensors and lab-on-a-chip devices

Manuel Luitz; Markus Lunzer; Markus Mader; Frederik Kotz-Helmer; Bastian E. Rapp

doi:10.1117/12.2608728

2 March 2022 Fabrication of platinum microstructures for sensors and lab-on-a-chip devices

Manuel Luitz, Markus Lunzer, Markus Mader, Frederik Kotz-Helmer, Bastian E. Rapp

Proceedings Volume 11955, Microfluidics, BioMEMS, and Medical Microsystems XX; 119550D (2022) https://doi.org/10.1117/12.2608728
Event: SPIE BiOS, 2022, San Francisco, California, United States

Abstract

Microstructured platinum (Pt) is of great importance in a variety of applications from electronics, sensors, microelectromechanical systems, Lab-on-a-Chip devices as well as medical implants such as the cochlear implant. The high electrical conductivity, high melting point, chemical resilience, high catalytic activity, and biocompatibility make Pt the material of choice in these applications. However, microstructuring of Pt and especially 3D microstructuring is challenging and mostly done using vapour-based techniques, which are restricted in the achievable designs or by novel 3D shaping methods, which are limited in terms of processing speed as well as purity and conductivity of the resulting platinum. We developed a platinum containing photoresin, which can be structured via direct lithography and two-photon polymerization. The resulting exposed platinum photoresin objects are subsequently converted to highly conductive and high purity platinum via thermal debinding and reduction. With the direct lithography method, we show that 2.5- dimensional microstructures, such as electrowetting on dielectric devices can be manufactured. By using two-photon polymerization, we show that complex 3D micro and nanoobjects can be fabricated paving the way for novel applications like metamaterials or catalysis as well as biomedical applications, where high surface areas and the physicochemical properties of Pt are highly desirable. By using lithography and two-photon lithography (TPL), we are able to obtain 2.5- dimensional Pt electrode patterns with a layer thickness of 35 nm and an electrical conductivity of 6.32 × 10⁶ S m^-1 as well as complex 3D Pt objects with a resolution of 2 μm and nanopillars of 700 nm, respectively.

Conference Presentation

Citation Download Citation

Manuel Luitz, Markus Lunzer, Markus Mader, Frederik Kotz-Helmer, and Bastian E. Rapp "Fabrication of platinum microstructures for sensors and lab-on-a-chip devices", Proc. SPIE 11955, Microfluidics, BioMEMS, and Medical Microsystems XX, 119550D (2 March 2022); https://doi.org/10.1117/12.2608728

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