Paper
27 October 2021 Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry
Daesuk Kim, Gukhyeon Hwang, Gukhyeon Hwang, Sukhyun Choi, Vamara Dembele, Saeid Kheiryzadehkhanghah, Inho Choi, Chung Song Kim, Daesuk Kim
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Abstract
This paper describes a new approach for large-scale thin film thickness mapping based on dynamic spectroscopic ellipsometry. The proposed system can provide a real time thin film uniformity measurement capability with high precision. We expect the proposed scheme can be applied for various large-scale thin film deposition process applications such as roll to roll manufacturing where real time process uniformity monitoring becomes crucial.
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Daesuk Kim, Gukhyeon Hwang, Gukhyeon Hwang, Sukhyun Choi, Vamara Dembele, Saeid Kheiryzadehkhanghah, Inho Choi, Chung Song Kim, and Daesuk Kim "Large scale thin film thickness uniformity extraction based on dynamic spectroscopic ellipsometry", Proc. SPIE 11927, Optical Technology and Measurement for Industrial Applications Conference 2021, 119270M (27 October 2021); https://doi.org/10.1117/12.2616271
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