PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
Integration of InP laser sources is a key enabling technology for Silicon Photonics and requires customised InP chips that meet the mechanical and optical requirements of a diverse range of Si Photonics architectures. The Sivers Photonics InP100 Platform is a common design and manufacturing framework for InP photonics devices that uses established process modules to produce a broad range of device types on 100mm wafers. This approach reduces cycle times for the development of customised device designs, has proven reliability, and is scalable to high volume manufacturing. The InP100 platform enables integration of customised InP chips with Si Photonics chips (e.g. via flip chip bonding), for applications for applications such as LIDAR, sensing and communications.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Iain Eddie, Andrew McKee, Laura Meriggi, Antonio Samarelli, Stuart Smyth, Horacio Cantu, "InP laser sources optimised for integration to SiPh circuits," Proc. SPIE 11880, Emerging Applications in Silicon Photonics II, 118800G (6 October 2021); https://doi.org/10.1117/12.2606476