Presentation + Paper
12 October 2021 Simulation of polychromatic effects in high NA EUV lithography
Author Affiliations +
Abstract
State-of-the-art EUV exposure systems utilize EUV radiation around 13.52 nm with a full band spectrum extend- ing from 13.2 nm to 13.8 nm. The variation of the wavelength in this range modifies the diffraction angles with an impact on the image blur and non-telecentricity effects. Dispersion of the materials on the EUV mirrors and on the 3D mask introduce an additional sensitivity of the imaging characteristics to the exposure wavelength. We employed the simulation models of the Fraunhofer IISB lithography simulator Dr.LiTHO in combination with measured optical material data from PTB to quantify the resulting image impact and to differentiate between the identified contributors to polychromatic imaging effects.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Erdmann, Hazem Mesilhy, Peter Evanschitzky, Qais Saadeh, Victor Soltwisch, Simon Bihr, Jörg Zimmermann, and Vicky Philipsen "Simulation of polychromatic effects in high NA EUV lithography", Proc. SPIE 11854, International Conference on Extreme Ultraviolet Lithography 2021, 1185405 (12 October 2021); https://doi.org/10.1117/12.2600931
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KEYWORDS
Photomasks

Mirrors

Extreme ultraviolet

Diffraction

Reflectivity

Extreme ultraviolet lithography

Lithography

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