Ultrashort pulse GHz burst mode laser ablation at different wavelengths for surface microfabrication

Francesc Caballero-Lucas; Kotaro Obata; Koji Sugioka

doi:10.1117/12.2577985

5 March 2021 Ultrashort pulse GHz burst mode laser ablation at different wavelengths for surface microfabrication

Francesc Caballero-Lucas, Kotaro Obata, Koji Sugioka

Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730B (2021) https://doi.org/10.1117/12.2577985
Event: SPIE LASE, 2021, Online Only

Abstract

Ultrashort pulsed lasers are becoming used in multiple applications thanks to their extremely short pulse durations, which confine processing within the irradiated zone and ensure a precise material ablation. However, ultrashort pulsed lasers encounter some challenges at high-speed material removal. In this situation, the use of higher power lasers for increasing ablation rates leads to detrimental effects due to heat accumulation. Recently, GHz burst mode laser ablation has been proposed as a method to overcome this limitation by applying ablation cooling. Following this approach, we study the influence of laser irradiation parameters in burst mode on the ablation efficiency and surface microfabrication quality with special interest in the use of different wavelengths, since most studies are often limited to use the fundamental wavelength in the near infrared. Bursts of pulses used in this study contain multiple pulses happening at an ultrafast ultrafast repetition rate of 5 GHz.

Conference Presentation

Citation Download Citation

Francesc Caballero-Lucas, Kotaro Obata, and Koji Sugioka "Ultrashort pulse GHz burst mode laser ablation at different wavelengths for surface microfabrication", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730B (5 March 2021); https://doi.org/10.1117/12.2577985

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